4188云顶集团

 Copper Clip Process Power Packaging

  ●Process Packaging of Anst's Copper Clip, used for power device packaging

                 

  ●Use the copper block to connect Source and lead-frame of MOS FET in order to get better Rdson and heating effect. 。

 Copper Clip Advantages

  ●Electrical Performance

  ●Thermal Performance  

 Clip Bond Application Fields